Machine of Mind: AI, Deep Tech, and the Future of Computing

An executive breakdown of TSMC’s milestone A14 process trial yield results, advancing next-generation Angstrom-class silicon readiness for hyperscaler AI accelerators and edge hardware. On July 18, 2026, details em…

Locked out of leading-edge lithography, Huawei abandons transistor shrinking and rewrites the scaling rulebook by folding logic into the third dimension. Figure 1: Moving past horizontal limitations by folding logic gates …

As conventional copper links melt under AI workloads, light-based substrate routing steps in to redefine advanced chip packaging.